The 5th IEEE Cyber Science and Technology Congress (CyberSciTech 2020)

The 5th IEEE Cyber Science and Technology Congress (CyberSciTech 2020)

June 22-26, 2020

Calgary, Canada

http://cyber-science.org/2020/

CONGRESS INTRODUCTION

Cyberspace, the seamless integration of physical, social, and mental spaces, is an integral part of our society, ranging from learning and entertainment to business and cultural activities, and so on. There are, however, in addition to its technical challenges, a number of pressing issues such as safety and trust associated with the cyberspace. For example, how do we strike a balance between the need for strong cybersecurity and preserving the privacy of ordinary citizens?
To address these challenges, there is a need to establish new science and research portfolios that incorporate cyber-physical, cyber-social, cyber-intelligent, and cyber-life technologies in a cohesive and efficient manner. This is the aim of the IEEE Cyber Science and Technology Congress (CyberSciTech). IEEE CyberSciTech has been successfully held in Auckland, New Zealand, in 2016, in Orlando, USA, in 2017, in Athens, Greece, in 2018, and in Fukuoka, Japan, in 2019.
In 2020, we will continue to offer IEEE CyberSciTech with the aim of providing a common platform for scientists, researchers, and engineers to share their latest ideas and advances in the broad scope of cyber-related science, technology, and application topics. In addition, this is also a platform to allow relevant stakeholders to get together, discuss and identify ongoing and emerging challenges, in order to understand and shape new cyber-enabled worlds.

IMPORTANT DATES

  • Workshop/SS Proposal Due: Nov. 30, 2019
  • Regular Paper Submission Due: Feb. 15, 2020
  • Wksp/SS/Poster Paper Due: Mar 10, 2020
  • Authors Notification: Apr. 01, 2020
  • Camera-ready Submission: May 10, 2020

SCOPE AND TRACKSs

Topics of interest include, but are not limited to:

Regular Tracks (6-8 pages)

  • Track 1: Cyberspace Theory & Technology
    • Cyberspace Property, Structure & Models
    • Cyber Pattern, Evolution, Ecology & Science
    • SDN/SDS, 5G/6G, Vehicle & Novel Network
    • Cloud, Fog, Edge & Green Computing
    • Big Data Analytics, Technology & Service
    • Infrastructures for Smart City/Country
  • Track 2: Cyber Security, Privacy & Trust
    • Cyber Security, Safety & Resilience
    • Cyber Crime, Fraud, Abuse & Forensics
    • Cyber Attack, Terrorism, Warfare & Defense
    • Cyber Privacy, Trust & Insurance
    • Blockchain, DLT Techniques & Applications
    • Post-quantum Cryptography
  • Track 3: Cyber Physical Computing & Systems
    • Cyber Physical Systems & Interfaces
    • Cyber Physical Dynamics & Disaster Relief
    • Cyber Manufacturing & Control
    • Embedded Systems & Software
    • Autonomous Robots & Vehicles
    • Internet of Things (IoT) & Smart Systems
  • Track 4: Cyber Social Computing & Networks
    • Social Networking & Computing
    • Computational Social Science
    • Crowd Sourcing, Sensing & Computing
    • Cyber Culture, Relation, Creation & Art
    • Cyber Social Right, Policy, Laws & Ethics
    • Cyber Learning, Economics & Politics
  • Track 5: Cyber Intelligence & Cognitive Science
    • Cyber/Digital Brain & Artificial Intelligence
    • Hybrid & Hyper-connected Intelligence
    • Affective/Mind Cognition & Computing
    • Brain/Mind Machine Interface
    • Intelligent Multimedia Technology
    • Intelligent Object, Environment & Service
  • Track 6: Cyber Life & Wellbeing
    • Cyber Life & Human Centric Computing
    • Cyber Medicine, Healthcare & Psychology
    • Cyborg/Wearable/Implantable Technology
    • Human/Animal Behavior Recognition
    • Personal Big Data & Personality Computing
    • Virtual, Augmented & Mixed Reality

Work-in-Progress (WiP) and Poster Tracks

IEEE CyberSciTech 2020 welcomes submissions of Work-in-Progress (WiP) and Poster papers describing on-going research progress.
​We welcome submissions within the scope of regular tracks.

IEEE CyberSciTech2020 CALLS

For original papers in:

  • Regular Tracks: 6-8 pages
  • WiP/Workshop/Special Session Tracks: 4-6 pages
  • Poster Track: 2 pages
  • All accepted conference (regular, WiP, poster), workshop, and special session papers will be published by IEEE in Conference Proceedings (IEEE-DL and EI indexed). Selected high quality papers will be recommended to prestige journal special issues.

SUBMISSION GUIDELINES

Authors are invited to submit their original work that has not previously been submitted or published in any other venue. Regular, Work-in-Progress (WiP), Workshop/Special Session, Poster papers all need to be in IEEE CS format (https://www.ieee.org/conferences/publishing/templates.html)

CO-LOCATED CONFERENCES

  • The 18th IEEE International Conf. on Pervasive Intelligence & Computing (PICom 2019)
  • The 18th IEEE International Conf. on Dependable, Autonomic & Secure Comp (DASC 2019)
  • The 6th IEEE Int’l Conf. on Cloud and Big Data Computing (CBDCom 2019)

ORGANIZING COMMITTEE

Honorary Chairs

  • Neil Fassina, Athabasca University, Canada
  • Stephen S. Yau, Arizona State University, USA

General Chairs

  • Oscar Lin, Athabasca University, Canada
  • Henry Leung, The University of Calgary, Canada

General Executive Chairs

  • Jun Zhao, Dalian University of Technology, China
  • Giancarlo Fortino, University of Calabria, Italy

Program Chairs

  • Antonio Liotta, Edinburgh Napier University, UK
  • Xiaokang Zhou, Shiga University, Japan
  • Zhipeng Cai, Georgia State University, USA

Program Co-Chairs

  • Katina Kralevska, Norwegian University of Science and Technology, Norway
  • Pavol Zavarsky, Concordia University of Edmonton, Canada
  • Yan Huang, Kennesaw State University, USA
  • Claudio Savaglio, University of Calabria, Italy
  • Sergey Butakov, Concordia University of Edmonton, Canada
  • Weimin Li, Shanghai University, China
  • Xiaokun Zhang, Athabasca University, Canada
  • Zhongyang Han, Dalian University of Technology, China
  • Wasim Ahmad, University of Glasgow, UKWasim Ahmad, University of Glasgow, UK
  • Celimuge Wu, The University of Electro-Communications, Japan
  • Lai Tu, Huazhong University of Sci.&Tech., China
  • Wenjia Li, New York Institute of Technology, USA

Workshop & Special Session Chairs

  • Ali Dewan, Athabasca University, Canada
  • Kenichi Kourai, Kyushu Institute of Technology, Japan
  • Pan Wang, Nanjing University of Post Telecom, China

Special Issue Chairs

  • Gautam Srivastava, Brandon University, Canada
  • Yan Ke, China Jiliang University, China

Tutorial Chair

  • Hao Zhu, Chongqing Univ. of Posts & Telecomm., China

Panel Chair

  • Frank Hsu, Fordham University, USA

International and Industrial Liaison & Publicity Chairs

  • Yuji Suga, Internet Initiative Japan, Japan
  • Kevin Cole, Athabasca University, Canada
  • Xiaohua Feng, University of Bedfordshire, UK
  • Chunyu Ai, University of South Carolina Upstate, USA
  • Xianjun Deng, St. Francis Xavier University, Canada/University of South China, China
  • Lingzhi Yi, St. Francis Xavier University, Canada/University of South China, China
  • Reza Soltani, York University, Canada

Finance Chair

  • Hongxin Yan, Athabasca University, Canada

Registration Chair

  • Jillian Calliou, Athabasca University, Canada

Local Organizing Committee

  • Oscar Lin (Chair), Athabasca University, Canada
  • Ali Dewan (co-Chair), Athabasca University, Canada
  • Joelle Jackson, Athabasca University, Canada
  • Jillian Calliou, Athabasca University, Canada
  • Kevin Cole, Athabasca University, Canada
  • Karen Stauffer Athabasca University, Canada
  • Chris Maton Athabasca University, Canada

Steering Committee

  • Jianhua Ma (Chair), Hosei University, Japan
  • Hui-Huang Hsu, Tamkang University, Taiwan
  • Qun Jin, Waseda University, Japan
  • Jun Wang, University of Central Florida, USA
  • Laurence T. Yang, St. Francis Xavier University, Canada
  • Stephen S. Yau, Arizona State University, USA
  • Mazin Yousif, T-Systems International, USA
  • Albert Zomaya, The University of Sydney, Australia

Advisory Committee

  • Bernady O. Apduhan, (Chair) Kyushu Sangyo University, Japan
  • Julien Bourgeois, UBFC/FEMTO-ST Institute/CNRS, France
  • Zhong Chen, Peking University, China
  • Raymond Choo, The Univ. of Texas at San Antonio, USA
  • Tadashi Dohi, Hiroshima University, Japan
  • Song Guo, Hong Kong Polytechnic University, Hong Kong
  • Keiichi Iwamura, The Tokyo University of Science, Japan
  • Seungcheon Kim, Hansung University, Korea
  • Jianwei Liu, Beihang University, China
  • Zhen Liu, Nagasaki Institute of Applied Science, Japan
  • Klimis Ntalianis, Univ. of West Attica, Greece
  • Yi Pan, Georgia State University, USA
  • Huansheng Ning, University of Science and Technology Beijing, China
  • Kouichi Sakurai, Kyushu University, Japan
  • Zhou Su, Xi’an Jiaotong University, China
  • Zhixin Sun, Nanjing University of Posts & Telecom., China
  • Nicolas Tsapatsoulis, Cyprus Univ. of Tech, Cyprus
  • Kevin I-Kai Wang, The University of Auckland, New Zealand
  • Feng Xia, Dalian University of Technology, China
  • Jianwei Yin, Zhejiang University, China
  • Qiang Zhang, Dalian University of Technology, China
  • Yanchun Zhang, Victoria University, Australia
  • Qiangfu Zhao, The University of Aizu, Japan
  • Qinggou Zhou, Lanzou University, China