The 22nd IEEE International Conference on Multimedia and Expo (ICME 2021)
July 5-9, 2021
Shenzhen, China
Call for Papers and Proposals
The IEEE International Conference on Multimedia & Expo (ICME) has been the flagship multimedia conference sponsored by four IEEE societies since 2000. It aims at promoting exchange of the latest advances in multimedia technologies, systems, and applications from both the research and development perspectives. ICME attracts well over 1000 submissions each year, serving as the prime forum for the dissemination of knowledge in the multimedia field.
ICME 2021 will take place July 5-9, 2021, Shenzhen, China. ICME 2021 will convene leading researchers and practitioners to share the latest developments and advances in the discipline. The conference will showcase high quality oral and poster presentations, as well as relevant Workshops sponsored by IEEE societies. An exposition of multimedia products, animations and industries will be also held in conjunction with the conference. Moreover, in ICME 2021 exceptional papers and contributors will be selected and recognized with prestigious awards.
Topics of interest include, but are not limited to:
- Artificial Intelligence for multimedia
- 3D multimedia, AR/VR and Immersive media
- Emerging multimedia applications and technologies
- Image/video processing
- Multimedia analysis and understanding
- Multimedia communications, networking and mobility
- Multimedia databases and data mining
- Multimedia for society and health
- Multimedia interaction
- Multimedia quality assessment and metrics
- Multimedia security, privacy and forensics
- Multimedia software, hardware and application systems
- Multimedia standards, trends and related research
- Multi-modal media computing and human-machine interaction
- Social media analysis and applications
- Speech/audio processing
Important Dates
Submission of papers
- Regular Paper submission (including Special Sessions) : November 29, 2020
- Submission of papers to workshops and other tracks : March 13, 2021
- Industry/Application track paper submission : March 22, 2021
Submission of proposals
- Special Session Proposals : November 01, 2020
- Panel Proposals : November 01, 2020
- Grand Challenge Proposals : November 01, 2020
- Workshop Proposals : November 01, 2020
- Tutorial Proposals : November 01, 2020
- Open Source Competition : March 01, 2021
- Demo Proposals : April 02, 2021
- Industry Expo Proposals : May 01, 2021
Conference and Journal Papers
All papers presented at ICME 2021 will be included in IEEE Xplore.
The IEEE Transactions on Multimedia is partnering with IEEE ICME. Extended versions of the top-ranked ICME 2021 papers will be invited for submission and potential publication in the IEEE Transactions on Multimedia and IEEE Open Journal of Circuits and Systems. We invite authors to submit high-quality contributions aiming at taking part in this call and to have the opportunity to publish an extended ICME paper in this prestigious journal. After the due review process, if your paper is highly ranked, the Technical Program Committee Chairs will get in touch with you regarding the next steps.
Organizing Committee
Honorary Chairs
- Chang Wen Chen
State University of New York at Buffalo, USA - Wen Gao
Peking University and Peng Cheng Lab, China
General Chairs
- Moncef Gabbouj
Tampere University of Technology, Finland - Houqiang Li
University of Science and Technology of China, China - Guo-Jun Qi
Futurewei Technologies/University of Central Florida, USA - Yonghong Tian
Peking University and Peng Cheng Lab, China
Technical Program Committee Chairs
- Wanqing Li
University of Wollongong, Australia - Jiaying Liu
Peking University, China - Guan-Ming Su
Dolby Labs, USA - Anastasios Tefas
Aristotle University of Thessaloniki, Greece - Yonggang Wen
Nanyang Technological University, Singapore - Chonggang Wang
InterDigital Communications, USA
Panel Chairs
- Gary Li
Peking University (Shenzhen), China - Marta Mrak
BBC R&D, UK - Shervin Shirmohammadi
University of Ottawa, Canada
Tutorial Chairs
- Giulia Boato
University of Trento, Italy - Jie Wang
University of Science and Technology of China, China
Workshop Chairs
- Ivan Bajic
Simon Fraser University, Canada - Abdulmotaleb El Saddik
University of Ottawa, Canada - Hongkai Xiong
Shanghai Jiaotong University, China
Industry Chairs
- Ali C. Began
Ozyegin University, Turkey - Dong Tian
InterDigital, Inc., USA - Qi Tian
Huawei Technologies & UTSA, China/USA
Industry Expo Chairs
- Han Hu
Beijing Institute of Technology, China - Wen-Huang Cheng
National Chiao Tung University, Taiwan
Publicity Chairs
- Alexandros Iosifidis
Aarhus University, Denmark - Dong Liu
University of Science and Technology of China, China - Yao Liu
Binghamton University, USA
Publication Chairs
- Giuseppe Valenzise
Laboratoire des Signaux et systmesè, France - Wengang Zhou
University of Science and Technology of China, China
Demo Chairs
- Zhenzhen Hu
Hefei University of Technology, China - Zechao Li
Nanjing University of Science and Technology, China
Special Session Chairs
- Junchi Yan
Shanghai Jiao Tong University, China - Yi Yu
National Institute of Informatics, Japan
Grand Challenge Chairs
- Shan Liu
Tencent Media Lab, China - Liqiang Nie
Shandong University, China - Zhengjun Zha
University of Science and Technology of China, China
Open Source Chairs
- Shiguang Shan
Institute of Computing Technology, China - Wei Hu
Peking University, China
Local Arrangement Chairs
- Jingfei Qiu
Peng Cheng Lab, China - Feng Zheng
Southern University of Science and Technology, China
Financial Chairs
- Xuejin Chen
University of Science and Technology of China, China - Xiaoxu Luan
Peng Cheng Lab, China
Sponsor Chairs
- Dan Zeng
Shanghai University, China - Yongdong Zhang
University of Science and Technology of China, China
Web Chair
- Qiaokang Xie
University of Science and Technology of China, China